Description

Introducing our innovative Thermal Conductive Insulating Pad, designed to enhance your electronic assembly and protection processes. Here’s a closer look at its key features:

1. Thermally Conductive Insulating:
   • Exhibits excellent thermal conductivity, facilitating efficient heat dissipation while providing insulation.
2. Soft and Shock-Absorbing:
   • Soft composition enables it to compress easily, effectively filling gaps between components to enhance shock absorption.
3. Self-Viscosity:
   • Features a peelable, slightly sticky surface for effortless fixation onto various surfaces.
4. Wide Applicability:
   • Versatile design makes it suitable for use with a wide range of chips and components across various electronic devices.
5. Easy Operation:
   • Simple to use – just stick it on once, and it’s ready to provide thermal insulation and shock absorption.
6. Good Plasticity:
   • Offers excellent plasticity, allowing for easy removal and cropping as needed to suit your specific requirements.

Upgrade your electronic assembly process with our Thermal Conductive Insulating Pad – the perfect solution for efficient heat dissipation, insulation, and component protection.